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Increase of uniformity of distribution of a thermal field at initial placement of topological IC cells

Authors
 Harutyunyan A.G.
Date of publication
 2008

Abstract
 In this paper the criterion and the corresponding approach for initial placement of cells of semi-conductor integrated circuits (IC), providing topological uniformity of distributions of a thermal field, and thus increasing thermal reliability. The mathematical kind of proposed criterion of initial placement is identical to traditional criteria of electric coherence of elements that allows to apply at a stage of initial placement additive multi-parameter criterion of the joint account of electric coherence and a thermal mode of IC elements.
Keywords
 thermal field, placement of topological IC cells
Library reference
 Harutyunyan A.G. Increase of uniformity of distribution of a thermal field at initial placement of topological IC cells // Problems of Perspective Micro- and Nanoelectronic Systems Development - 2008. Proceedings / edited by A. Stempkovsky, Moscow, IPPM RAS, 2008. P. 251-254.
URL of paper
 http://www.mes-conference.ru/data/year2008/45.pdf

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