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Temperature sensors modeling for smart power ICs

Authors
 Petrosyants K.O.
 Ryabov N.I.
Date of publication
 2010

Abstract
 Two types of P-N junction temperature sensors built in the smart power ICs are discussed: with small emitter and with long strip emitter. The classic 3D heat conduction equation for IC construction is numerically solved to obtain the temperature distribution on the IC layout. The optimal from the electro-thermal standpoint examples of the sensor placement on the IC chip are demonstrated. The rules for small emitter sensor placement are established to minimize the measured temperature errors. It is shown for long strip emitter sensors that emitter current crowding and thermoelectric (Seebeck) effects must be taken into account.
Keywords
 Smart power IC, temperature sensor, thermal modeling.
Library reference
 Petrosyants K.O., Ryabov N.I. Temperature sensors modeling for smart power ICs // Problems of Perspective Micro- and Nanoelectronic Systems Development - 2010. Proceedings / edited by A. Stempkovsky, Moscow, IPPM RAS, 2010. P. 80-85.
URL of paper
 http://www.mes-conference.ru/data/year2010/papers/m10-347-00921.pdf

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