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Flip Chip package design for sophisticated ASIC under small lot production

Authors
 Bychkov I.N.
Date of publication
 2012

Abstract
 This paper introduces specialties of package design for perspective microprocessors under small lot production less than five thousand items. Aggregate design problems and methods of solution are unique. Applied Flip Chip technology defines chip reliability levels. Package design is realized via FCPacker in-house CAD tools.
Keywords
 Flip Chip package, die periphery I/O, FCPacker CAD tools
Library reference
 Bychkov I.N. Flip Chip package design for sophisticated ASIC under small lot production // Problems of Perspective Micro- and Nanoelectronic Systems Development - 2012. Proceedings / edited by A. Stempkovsky, Moscow, IPPM RAS, 2012. P. 267-272.
URL of paper
 http://www.mes-conference.ru/data/year2012/pdf/D164.pdf

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